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backside metallization
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  1. Tango Systems, Inc. - Innovative and Cost Effective PVD Solutions

    Tango Systems designs, manufactures, markets and services high volume manufacturing PVD systems that enable advanced IC packaging PVD sputtering tools
    MEMS1
    ICP1
    TSV1
    BSM1
    die attach1
    UBM1
    Pb-Free1
    Integrated Passives1
    PVD system1
    nanofilms1
    advanced IC packaging1
    Advanced Silicon1
    backside metallization1
    Au Bumps0
    Axcela0
    D-Source0

    www.tangosystemsinc.com - 2009-02-08

  2. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    semiconductor2
    MEMS1
    electroplating1
    etch1
    PVD1
    Cirrus1
    Stratus1
    CVD1
    Nimbus1
    flip chip1
    flipchip1
    UBM1
    flip-chip1
    electrodeposition1
    integrated passives1
    sputter deposition1
    wafer-level packaging1
    backside metallization1
    thin wafer processing1
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

jvx 6200i1 ubm1 fine pitch bga1 nanotechnology2 etch1 integrated passives1 mems1 micro2 land grid array1 nano2 process control2 fold-over1

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